CSI 900+ Digital Desoldering & Hot Air Rework Station with 50W Soldering Iron

CSI 900+

ESD Safe, CPU Controlled Hot Air Rework Station with 50W Iron

An impressive high value hot air rework system implementing advanced diaphragm pump design that also incorporates a 50 watt soldering iron.

The CSI 900+ is a digital hot air rework station designed for assembly and repair.

The unit allows the user to control hot air flow and hot air temperature at the push of a button.

It comes with a 12 month UK warranty.

Features:

• Microprocessor Controlled Desoldering Station

• High quality diaphragm pump (not a rotary fan as found on many cheaper models)

• Temperature sleep mode

• Includes 4 straight single hot air nozzles

• Digital Temperature Displays for Hot Air and for Soldering Iron. User may select Celcius or Fahrenheit Display.

 

The CSI 900+ incorporates a SAMSUNG SCM, PID program to track the temperature of the hot air heating element and the soldering iron heating element in real time.

This allows the system to quickly react and keep temperatures stable with fast recovery.

The hot air gun has an auto-cooldown feature. When the user turns off the power switch, the  hot air gun continues to blow air until the element  returns to 100 deg F. This feature helps to enhance the life expectancy of the heating element.

Circuit Specialists stock a wide range of soldering & hot air tips as well as a replacement soldring wand & hot air heating element for this unit (see the `Related Products' section at the side of this page)

SPECIFICATION:

• VAC input: 230 V +/- 10%
• Machine total Power: 700 watts max
• Hot Air Power: 550 watts max
• Soldering iron Power: 50 watts max
• Temperature Range Hot Air Gun: 212 deg F to 842 deg F (100 deg C to 450 deg C)
• Temperature Range Soldering Iron: 392 deg F to 896 deg F (200 deg C to 480 deg C)
• Mode of Airflow: Diaphram pump
• Airflow: 24L/min. max
• Display: LED
• Heating Elements: pump: Ceramic skeleton/ Soldering Iron: Ceramic
• Temperature Control: PID Digital Program every 200 ms
• Tips to ground Impedance (soldering iron): <2 ohms
• Tip voltage to ground: <2mV
• Includes (1) KD-M-0.8D 0.8mm Chisel Tip and (4) Hot Air nozzles

It is capable of reaching temperatures high enough for the reflow of lead free and leaded solder alike. In some instances where the application involves particularly large ICs or a highly heat-conductive board, it may be necessary to add a preheater such as our CSI 853B. 

The profile (heat and airflow settings) required to rework any given chip can vary. We always recommend that the user practice on a dead board to assess the optimum heat / airflow settings for the specific application.

Where a concentration of air is required, we stock a range of BGA, QFP, PLCC, SOP, and SIP nozzles to help direct the air to where it is needed. 

Compatible with all of the hot air nozzles that we stock. See the side panel of this page for details.

 

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