Lead Free No Clean Solder Paste Tub by MG Chemicals 4900P-250G

Lead Free No Clean Solder Paste by MG Chemicals

Part No.: 4900P-250G

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.

Catalog Number	Sizes Available	Description
4900P-25G	25 g (0.88 oz)	Syringe
4900P-250G	250 g (8.81 oz)	Jar

Features

Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Repeatable and consistent print characteristics
Long stencil and tack life to accommodate high speed printing
Excellent wettability
Suitable for air or nitrogen atmosphere
Medium soft, non-cracking residues
Dobb-Frank (DRC conflict free)
REACH (compliant)
RoHS (compliant)

Physical & Chemical Characteristics (Flux Extract)	RA
Color & Appearance	Amber Solid
Softening Point, °C (Flux Extract)	80°
Acid Number (mgKOH/g sample)	150-160
Silver Chromate (Qualitative Halides)	Detection
Classification Per J-STD-004	ROM1
Surface Insulation Resistance	> 1.0 x 10⁹
Shelf Life	Indefinite
Residue Removal	Not required

Lead free/leaded solder comparison	Lead Free Solder (Sn/Cu)	Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit	Do not to exceed 350 ºC (tip temperature)	Do not to exceed 260 ºC (tip temperature)

- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf

Physical & Chemical Characteristics (Flux Extract)	RA
Color & Appearance	Amber Solid
Softening Point, °C (Flux Extract)	80°
Acid Number (mgKOH/g sample)	150-160
Silver Chromate (Qualitative Halides)	Detection
Classification Per J-STD-004	ROM1
Surface Insulation Resistance	> 1.0 x 10⁹
Shelf Life	Indefinite
Residue Removal	Not required

Lead free/leaded solder comparison	Lead Free Solder (Sn/Cu)	Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit	Do not to exceed 350 ºC (tip temperature)	Do not to exceed 260 ºC (tip temperature)

- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf

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