Lead Free No Clean Solder Paste Tub by MG Chemicals 4900P-250G

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Quick Overview

Lead Free No Clean Solder Paste. Residues are non-conductive, non-corrosive and highly insulated

Details

Lead Free No Clean Solder Paste by MG Chemicals

Part No.: 4900P-250G

The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications & Usages

The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.

Catalog NumberSizes AvailableDescription
4900P-25G 25 g (0.88 oz) Syringe
4900P-250G 250 g (8.81 oz) Jar

Features
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Repeatable and consistent print characteristics
  • Long stencil and tack life to accommodate high speed printing
  • Excellent wettability
  • Suitable for air or nitrogen atmosphere
  • Medium soft, non-cracking residues
  • Dobb-Frank (DRC conflict free)
  • REACH (compliant)
  • RoHS (compliant)

Physical & Chemical Characteristics (Flux Extract)RA
Color & Appearance Amber Solid
Softening Point, °C (Flux Extract) 80°
Acid Number (mgKOH/g sample) 150-160
Silver Chromate (Qualitative Halides) Detection
Classification Per J-STD-004 ROM1
Surface Insulation Resistance > 1.0 x 109
Shelf Life Indefinite
Residue Removal Not required
Lead free/leaded solder comparisonLead Free Solder (Sn/Cu)Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit Do not to exceed 350 ºC (tip temperature) Do not to exceed 260 ºC (tip temperature)
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
Physical & Chemical Characteristics (Flux Extract)RA
Color & Appearance Amber Solid
Softening Point, °C (Flux Extract) 80°
Acid Number (mgKOH/g sample) 150-160
Silver Chromate (Qualitative Halides) Detection
Classification Per J-STD-004 ROM1
Surface Insulation Resistance > 1.0 x 109
Shelf Life Indefinite
Residue Removal Not required
Lead free/leaded solder comparisonLead Free Solder (Sn/Cu)Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit Do not to exceed 350 ºC (tip temperature) Do not to exceed 260 ºC (tip temperature)
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf

Additional Information

Brand MG Chemicals
MG Product Type Solder Paste