No Clean Solder
MG Chemicals Part No.: 4865-454G
63% tin, 37% lead
M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator.
Our No Clean formula wets and spreads like normal RA type flux and does not splatter.
Features / Benefits
- Meets J-STD-004 and QQ-S-571
- No Clean
- Standard Flux Core percentage at 2.2%
- Melting Point: 183 ° C / 361 ° F
|MG Product Type||Solder Wire - Leaded|