Flowable Thermal Conductive Epoxy Adhesive - Medium Cure 8329TFM-25ML
Medium Cure Flowable Thermal Conductive Adhesive 8329TFM-25ML
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MG Product No. - 8329TFM–25ML
NB: This is a THERMALLY conductive epoxy. For electrically conductive epoxy, see MG Chemicals 8331.
8329TFM - MEDIUM CURE THERMALLY CONDUCTIVE ADHESIVE, FLOWABLE
This is a two-part, smooth, dark grey paste that cures to form a hard, durable polymer that is extremely thermally conductive, yet electrically insulating. It is filled with thermally conductive ceramic powders for excellent thermal conductivity. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.
It has a convenient 1-to-1 mix ratio, a 45 minutes working life, and a moderate curing rate. It can be cured in 24 hours at room temperature or 90 minutes at 80 °C.
This product comes packaged in a 25 mL manual dual syringe or a 50 mL industrial, dual-cartridge for use with a dispensing gun and static mixing tips.
Dispensing Gun 8DG-50-1-1 sold seperately
Additional static mixers 8MT-25 or 8MT-50 sold separately for 8329TFM-50ML only
Applications & Usages
The 8329TFM epoxy is used for bonding heat sinks, LED’s, and other heat generating components in electronic assemblies. It is suitable for use in manufacturing operations including automatic dispensing applications. It is also useful in the maintenance, repair, and hobbyist sectors. Use it when a flowable adhesive with excellent thermal conductivity and a moderate working life is required.
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