Lead Free No Clean Solder Paste by MG Chemicals
Part No.: 4900P-250G
The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
Applications & Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm.
| Catalog Number | Sizes Available | Description |
|---|
| 4900P-25G |
25 g (0.88 oz) |
Syringe |
| 4900P-250G |
250 g (8.81 oz) |
Jar |
| Features |
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent print characteristics
- Long stencil and tack life to accommodate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmosphere
- Medium soft, non-cracking residues
- Dobb-Frank (DRC conflict free)
- REACH (compliant)
- RoHS (compliant)
|
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|
| Color & Appearance |
Amber Solid |
| Softening Point, °C (Flux Extract) |
80° |
| Acid Number (mgKOH/g sample) |
150-160 |
| Silver Chromate (Qualitative Halides) |
Detection |
| Classification Per J-STD-004 |
ROM1 |
| Surface Insulation Resistance |
> 1.0 x 109 |
| Shelf Life |
Indefinite |
| Residue Removal |
Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|
| Upper Temperature Limit |
Do not to exceed 350 ºC (tip temperature) |
Do not to exceed 260 ºC (tip temperature) |
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|
| Color & Appearance |
Amber Solid |
| Softening Point, °C (Flux Extract) |
80° |
| Acid Number (mgKOH/g sample) |
150-160 |
| Silver Chromate (Qualitative Halides) |
Detection |
| Classification Per J-STD-004 |
ROM1 |
| Surface Insulation Resistance |
> 1.0 x 109 |
| Shelf Life |
Indefinite |
| Residue Removal |
Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|
| Upper Temperature Limit |
Do not to exceed 350 ºC (tip temperature) |
Do not to exceed 260 ºC (tip temperature) |
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
