Sn63 / Pb37 No Clean Solder Paste by MG Chemicals 4860P-35G

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Quick Overview

Lead Free No Clean Solder Paste. Residues are non-conductive, non-corrosive and highly insulated

Details

Sn63 / Pb37 No Clean Solder Paste by MG Chemicals 

Sn63/Pb37 No Clean Solder Paste New Item
Sn63/Pb37 No Clean Solder Paste New Item
Sn63/Pb37 No Clean Solder Paste

Part No.: 4860P-35G

The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. 

The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.

Features & Benefits

  •     Low residues
  •     Easily dispensed
  •     Excellent wettability
  •     Hard non-conductive residue

The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method.  The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.

Features & Benefits

  • Low residues
  • Easily dispensed
  • Excellent wettability
  • Hard non-conductive residues
- See more at: http://www.mgchemicals.com/products/solder/leaded-solder-paste/sn63pb37-no-clean-solder-paste-4860p/#sthash.tjKKfyIY.dpuf
Physical & Chemical Characteristics (Flux Extract)RA
Color & Appearance Amber Solid
Softening Point, °C (Flux Extract) 80°
Acid Number (mgKOH/g sample) 150-160
Silver Chromate (Qualitative Halides) Detection
Classification Per J-STD-004 ROM1
Surface Insulation Resistance > 1.0 x 109
Shelf Life Indefinite
Residue Removal Not required
Lead free/leaded solder comparisonLead Free Solder (Sn/Cu)Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit Do not to exceed 350 ºC (tip temperature) Do not to exceed 260 ºC (tip temperature)
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
Physical & Chemical Characteristics (Flux Extract)RA
Color & Appearance Amber Solid
Softening Point, °C (Flux Extract) 80°
Acid Number (mgKOH/g sample) 150-160
Silver Chromate (Qualitative Halides) Detection
Classification Per J-STD-004 ROM1
Surface Insulation Resistance > 1.0 x 109
Shelf Life Indefinite
Residue Removal Not required
Lead free/leaded solder comparisonLead Free Solder (Sn/Cu)Sn63/Pb37 (Leaded Solder)
Upper Temperature Limit Do not to exceed 350 ºC (tip temperature) Do not to exceed 260 ºC (tip temperature)
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf

Additional Information

Brand MG Chemicals
MG Product Type Solder Paste