NON-SILICONE HEAT TRANSFER COMPOUND 8610-60G

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Excl. Tax: £6.55 Incl. Tax: £7.86

Quick Overview

Non-Silicone Heat Transfer Compound. Uses synthetic fluids and metal oxide fillers. Provides excellent conductive properties

Details

8610-60G Non-Silicone Heat Transfer Compound

  • Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
  • High efficient thermal conductive properties - Means more rapid transfer of heat for longer component life
  • High temperature stability - Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
  • Uses synthetic fluids and metal oxide fillers - Provides excellent conductive properties that exceed those of other heat sink formulas
  • Will not dry, harden, melt or migrate in any heat sink application
  • Compatible with metal and plastic components
  • Also available in a silicone version


Benefits of Non Silicone Heat Transfer Compound OVER Silicone Compound

No migration and component contamination.

 

Applications:

Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
Other uses:

  • Semiconductor Mounting Devices
  • Thermal joints
  • Ballast heat transfer mediums
  • Power resistor mountings
  • Thermocouple wells
  • Transistor diodes & silicone rectifier base and mounting studs
  • ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required

Additional Information

Brand MG Chemicals
MG Product Type Grease - Thermal