Sn63 / Pb37 No Clean Solder Paste by MG Chemicals
Sn63/Pb37 No Clean Solder Paste

Sn63/Pb37 No Clean Solder Paste

Sn63/Pb37 No Clean Solder Paste
Part No.: 4860P-35G
The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method.
The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.
Features & Benefits
- Low residues
- Easily dispensed
- Excellent wettability
- Hard non-conductive residue
The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.
Features & Benefits
- Low residues
- Easily dispensed
- Excellent wettability
- Hard non-conductive residues
- See more at: http://www.mgchemicals.com/products/solder/leaded-solder-paste/sn63pb37-no-clean-solder-paste-4860p/#sthash.tjKKfyIY.dpuf
Physical & Chemical Characteristics (Flux Extract) | RA |
Color & Appearance |
Amber Solid |
Softening Point, °C (Flux Extract) |
80° |
Acid Number (mgKOH/g sample) |
150-160 |
Silver Chromate (Qualitative Halides) |
Detection |
Classification Per J-STD-004 |
ROM1 |
Surface Insulation Resistance |
> 1.0 x 109 |
Shelf Life |
Indefinite |
Residue Removal |
Not required |
Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
Upper Temperature Limit |
Do not to exceed 350 ºC (tip temperature) |
Do not to exceed 260 ºC (tip temperature) |
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
Physical & Chemical Characteristics (Flux Extract) | RA |
Color & Appearance |
Amber Solid |
Softening Point, °C (Flux Extract) |
80° |
Acid Number (mgKOH/g sample) |
150-160 |
Silver Chromate (Qualitative Halides) |
Detection |
Classification Per J-STD-004 |
ROM1 |
Surface Insulation Resistance |
> 1.0 x 109 |
Shelf Life |
Indefinite |
Residue Removal |
Not required |
Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
Upper Temperature Limit |
Do not to exceed 350 ºC (tip temperature) |
Do not to exceed 260 ºC (tip temperature) |
- See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf