Description
Lead Free Solder Wire
MG Chemicals Part No.; 4900-35G
0.81mm, 96.3% tin, 0.7% copper and 3% silver
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.
If your products might enter Europe or California, you must ensure they are RoHS compliant. Products containing lead will not comply. To read more on this issue visit our RoHS Issue AppGuide |
Features / Benefits
- Lead free
- Complies with RoHS
- Exceeds the impurity requirements of J-Std-006
- No Clean flux
- 21 Gauge, 0.032″ diameters
- Excellent wettability
- Hard non-conductive residues
- 1 lb of lead free solder has 27% more length than leaded solder
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.
| Test Method | Specification | |
|---|---|---|
| Ag content | 2.8-3.2% | |
| Cu content | 0.3-0.7% | |
| Sn content | Balance | |
| Flux Classification | JSTD-004 | ORL0 |
| Copper Mirror | IPC-TM-650 2.3.32 | No removal of copper film |
| Silver Chromate | IPC-TM-650 2.3.33 | Pass |
| Corrosion | IPC-TM-650 2.6.15 | Pass |
| SIR JSTD-004,Pattern Down | IPC-TM-650 2.6.3.3 | 2.33 x 1011 ohms |
| SIR Bellcore (Telecordia) | Bellcore GR-78-CORE 13.1.3 | 6.12 x 1011 ohms |
| Electromigration | Bellcore GR-78-CORE 13.1.4 | Pass |
| Post Reflow Flux Residue | TGA Analysis | 55% |
| Acid Value | IPC-TM-650 2.3.13 | 190-210 |
| Flux Residue Dryness | IPC-TM-650 2.4.47 | Pass |
| Spitting of Flux-Cored Solder | IPC-TM-650 2.4.48 | 0.3% |
| Solder Spread | IPC-TM-650 2.4.46 | 130 mm2 |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Ag/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Melting Point | 217-221ºC (422.6 – 429.8ºF) | 183 ºC (361.4 ºF) |
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |
| Wire Diameter | 0.032” (0.81 mm) | 0.032” (0.81 mm) |
| Std. Wire Gauge | 21 | 21 |
| Tolerance, in. | +/- 0.002” | +/- 0.002” |
| Hardness, Brinell | 15HB | 14HB |
| Coefficient of Thermal Expansion | Pure Sn=23.5 | 24.7 |
| Tensile Strength | 4312 psi | 4442 psi |
| Density | 7.39 g/cc | 8.42 g/cc |
| Electrical Resistivity | 13.0 μohm-cm | 14.5 μohm-cm |
| Electrical Conductivity | 16.6 %IACS | 11.9 %IACS |
| Yield Strength, psi | 3724 | 3950 |
| Total Elongation,% | 27 | 48 |
| Joint Shear Strength, at 0.1mm/min 20ºC | 17 | 14 |
| Creep Strength, N/mm2 at 0.1mm/min 20ºC | 13.0 | 3.3 |
| Creep Strength, N/mm2 at 0.1mm/min 100°C | 5 | 1 |
| Thermal Conductivity | 58.7 W/m * K | 50.9 W/m * K |
– See more at: http://www.mgchemicals.com/products/solder/non-leaded/sn96-4900/#sthash.CN1PtFSS.dpuf
