Description
Sn63 / Pb37 No Clean Solder Paste by MG Chemicals
Part No.: 4860P-35G
The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method.
The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.
Features & Benefits
- Low residues
- Easily dispensed
- Excellent wettability
- Hard non-conductive residue
The MG 4860P No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, noncorrosive and highly insulated.
Features & Benefits
- Low residues
- Easily dispensed
- Excellent wettability
- Hard non-conductive residues
– See more at: http://www.mgchemicals.com/products/solder/leaded-solder-paste/sn63pb37-no-clean-solder-paste-4860p/#sthash.tjKKfyIY.dpuf
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|---|
| Color & Appearance | Amber Solid |
| Softening Point, °C (Flux Extract) | 80° |
| Acid Number (mgKOH/g sample) | 150-160 |
| Silver Chromate (Qualitative Halides) | Detection |
| Classification Per J-STD-004 | ROM1 |
| Surface Insulation Resistance | > 1.0 x 109 |
| Shelf Life | Indefinite |
| Residue Removal | Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |
– See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|---|
| Color & Appearance | Amber Solid |
| Softening Point, °C (Flux Extract) | 80° |
| Acid Number (mgKOH/g sample) | 150-160 |
| Silver Chromate (Qualitative Halides) | Detection |
| Classification Per J-STD-004 | ROM1 |
| Surface Insulation Resistance | > 1.0 x 109 |
| Shelf Life | Indefinite |
| Residue Removal | Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |
– See more at: http://www.mgchemicals.com/products/solder/leaded/sn60-pb40-4890/#sthash.18hWv0UF.dpuf
