Solder Wire Tube 18g 0.83mm Sn60 / Pb40 Leaded 4890-18G
Solder Wire Tube
MG Chemicals Part No.: 4890-18G
60% tin, 40% lead
M.G. Chemicals Rosin Activated Flux formula is used in this flux-cored Solder Wire.
Its rapid wetting and fast flowing properties results in consistent and reliable soldering every time.
Cleaning becomes optional with the RA Flux core because of its non-corrosive and electrically non-conductive properties.
Features / Benefits
- Meets J-STD-004 / J-STD-006
- Non-corrosive and electrically non-conductive flux residue
- Standard Flux Core percentage at 2.2%
- Melting Point: 183 ° C / 361 ° F
Technical Data
| Physical & Chemical Characteristics (Flux Extract) | RA |
| Color & Appearance | Amber Solid |
| Softening Point, °C (Flux Extract) | 80° |
| Acid Number (mgKOH/g sample) | 150-160 |
| Silver Chromate (Qualitative Halides) | Detection |
| Classification Per J-STD-004 | ROM1 |
| Surface Insulation Resistance | > 1.0 x 109 |
| Shelf Life | Indefinite |
| Residue Removal | Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|---|
| Color & Appearance | Amber Solid |
| Softening Point, °C (Flux Extract) | 80° |
| Acid Number (mgKOH/g sample) | 150-160 |
| Silver Chromate (Qualitative Halides) | Detection |
| Classification Per J-STD-004 | ROM1 |
| Surface Insulation Resistance | > 1.0 x 109 |
| Shelf Life | Indefinite |
| Residue Removal | Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |
| Physical & Chemical Characteristics (Flux Extract) | RA |
|---|---|
| Color & Appearance | Amber Solid |
| Softening Point, °C (Flux Extract) | 80° |
| Acid Number (mgKOH/g sample) | 150-160 |
| Silver Chromate (Qualitative Halides) | Detection |
| Classification Per J-STD-004 | ROM1 |
| Surface Insulation Resistance | > 1.0 x 109 |
| Shelf Life | Indefinite |
| Residue Removal | Not required |
| Lead free/leaded solder comparison | Lead Free Solder (Sn/Cu) | Sn63/Pb37 (Leaded Solder) |
|---|---|---|
| Upper Temperature Limit | Do not to exceed 350 ºC (tip temperature) | Do not to exceed 260 ºC (tip temperature) |